9 edition of Handbook of thin-film deposition processes and techniques found in the catalog.
Includes bibliographical references and index.
|Statement||edited by Krishna Seshan.|
|Genre||Handbooks, manuals, etc.|
|LC Classifications||TK7872.T55 H36 2000|
|The Physical Object|
|LC Control Number||99088400|
Electrohydrodynamic deposition electrospray deposition is a relatively new process of thin-film deposition. Extensive references allow the reader to pursue subjects in greater detail if desired. Entirely new chapters on contamination and contamination control describe the basics and the issues-as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. Deposition of thin films by the main physical deposition methods of vacuum evaporation, molecular-beam epitaxy and sputtering are described in some detail, as are those by the chemical deposition methods of electrodeposition, chemical vapour deposition and the Langmuir—Blodgett technique. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.
Many of the topics coved in this chapter are explained in more detail in various books. Such considerations have implications regarding the sticking coefficients for deposited materials i. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. When temperature variations in L are taken into account, Pulses of focused laser light vaporize the surface of the target material and convert it to plasma; this plasma usually reverts to a gas before it reaches the substrate.
The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. In MBE the background pressure is considerably lower than in the case of the simpler evaporation techniques, i. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. However, it also depends on the atomic properties of the incident ions and the target atoms.
Report of the Commission on Speedy Trials in Criminal Cases, to the Governor and the General Assembly of Virginia.
Religious instruction and the American public school
The science of self
Ways and means
Wading into Wetlands (Ranger Ricks Naturescope Series)
Jolly old St. Nick
Chevy LS engine conversion handbook
Cancer and heart disease
A compleat collection of the standing orders of the House of Lords in England
The anatomy of a party
Grant and Lee
Films prepared from larger molecules, such as the organic phthalocyanines having molecular weights of the order ofcan also show several quite complex structures.
The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Thermal conductivity should be high for films whose applications will entail significant power dissipation.
Various alternative types of glaze have since been developed, and are used both to overcome the effects of porosity in pottery and for decorative purposes.
The physical methods of vacuum evaporation and sputtering are perhaps the most controllable, giving the best-quality films. Through the influence of electric field, the liquid coming out of the nozzle takes a conical shape Taylor cone and at the apex of the cone a thin jet emanates which disintegrates into very fine and small positively charged droplets under the influence of Rayleigh charge limit.
The SI system of units is used throughout, and where original work was presented in non-SI units, these have normally been converted. The substrate on which the film has to be deposited is connected to ground. Year: Nevertheless, although the theoretical framework is in place for the controlled evaporation of compounds, the exact type of dissociation and decomposition are not known in all cases, and for compounds consisting of three or more elements this problem is compounded.
It is especially useful for compounds or mixtures, where different components would otherwise tend to evaporate at different rates.
However, at elevated temperatures the oxides themselves may dissociate, with the liberated oxygen reacting with the evaporant to form its own oxide. It is a fast technique and also it provides a good thickness control. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature.
Entirely new chapters on contamination and contamination control describe the basics and the issues?? The liquid to be deposited, either in the form of nanoparticle solution or simply a solution, is fed to a small capillary nozzle usually metallic which is connected to a high voltage.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials. The dependence of these features on the deposition conditions are stressed, including those required for the growth of epitaxial films and the use of zone models in the classification of the morphological characteristics.
The dependence of sputtering yield on the atomic number of the incident ions is quite striking, as shown in Fig. Other compounds dissociate on evaporation into two different vapour species.
The droplets keep getting smaller and smaller and ultimately get deposited on the substrate as a uniform thin layer. Much of the technology associated with thin-film deposition and growth is explicitly excluded from this discussion. The book includes much cutting-edge material. Other customary units, such as the electronvolt, are used where appropriate.
It was not commonly used in semiconductor processing for many years, but has seen a resurgence with more widespread use of chemical-mechanical polishing techniques.Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas.
Handbook of Thin-Film Deposition Processes and Techniques: Principles, Methods, Equipment and Applications Krishna Seshan New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries.
HANDBOOK OF DEPOSITION TECHNOLOGIES FOR FILMS AND COATINGS, Second HANDBOOK OF THIN FILM DEPOSITION PROCESSES AND TECHNIQUES: edited by Klaus To fill this need is the purpose of this book.
Handbook of Thin Film Deposition Processes and Techniques: Principles, Methods Enter your mobile number or email address below and we'll send you a link to download the free Kindle App. Then you can start reading Kindle books on your smartphone, tablet, or computer - no Kindle device atlasbowling.com: Krishna Seshan.
HANDBOOK OF THIN-FILM DEPOSITION PROCESSES AND TECHNIQUES Principles, Methods, Equipment and Applications Second Edition Edited by Krishna Seshan Intel Corporation Santa Clara, California NOYES PUBLICATIONS WILLIAM ANDREW PUBLISHING Norwich, New York, U.S.A.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical atlasbowling.com: Krishna Seshan.